Wafer-Level Chip Scale Package （WLCSP） is one of the most cost-effective and space-efficient packaging options. The die size of Puya products has leading competitiveness, so Puya WLCSP is a true chip-scale package.  Puya provides WLCSP SPI NOR Flash, IIC EEPROM & VCM Driver products for mobile or portable form facotr applications, such as 3D-CCM, digital cameras , smart watches, GPS navigation devices, etc.

SPI NOR Flash

Base on the chip size, Puya develops a series of SPI NOR Flash WLCSP products. All of Puya's  WLCSP products are manufactured and tested in SMIC to ensure the quality and reliability.

Series Supply Density Data Retention
• 0.4x0.4（3-2-3）8-Ball 1.65-2.0V , 2.3-3.60V , 1.65-3.60V 2Mb~8Mb 20Y
• 0.4x0.4（4-4）8-Ball 1.65-2.0V , 2.3-3.60V , 1.65-3.60V 512Kb~2Mb 20Y
• 0.5x0.5（4-4）8-Ball 1.65-2.0V , 2.3-3.60V , 1.65-3.60V 16Mb~32Mb 20Y
• 0.5x0.5（2-4-4-2）12-Ball 1.65-2.0V , 2.3-3.60V , 1.65-3.60V 64Mb 20Y
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IIC EEPROM

Puya develops high reliability IIC EEPROM WLCSP products combining unique design and advanced process, while keeps the high performance as packaged  products. 

Series Supply Density Data Retention
• 0.4x0.4 4-Ball 1.7~5.5V 32Kb~128Kb 100Y
• 0.4x0.5 4-Ball 1.7-5.5V 64Kb~128Kb 100Y
• 0.5x0.5 6-Ball 1.7-5.5V 2Kb~32Kb 100Y
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