Puya designs & offers industrial level series, ultra-high reliability series and automotive series IIC EEPROM, with the densities ranging from 2Kb to 1024Kb. Based on the excellent quality and outstanding customer service, Puya IIC EEPROM product line has been approved by numerous electronics customers.
Up to 4M cycling and 200 year data retention
6000V HBM / 200mA 125C Latch-up capability
0.5uA standby current / 1.5mA program current
3ms write time/ 1.7V 1MHz bus frequency
Safety protection for power on-off / Anti-noise IO design
ID page for customer encryption
100% room temperature and high temperature CP
Full series SOP/TSSOP/UDFN support / 2K-256K SOT23 support
Known Good Die (KGD) support
Wafer-Level Chip Scale Package (WLCSP) support
P24C02A-MI
1MHz
1.7~5.5V
-40~85℃
/
100Y
-
Mass Production
SOP 150mil / TSSOP 8-lead /
DFN(2X3) / UDFN(2X3) /
DIP 8-lead / SOT23 5 PIN /
TSOT23 5 PIN
P24C02C-MI
1MHz
1.7~5.5V
-40~85℃
/
100Y
O
Mass Production
SOP 150mil / TSSOP 8-lead /
DFN(2X3) / UDFN(2X3) /
DIP 8-lead / SOT23 5 PIN /
TSOT23 5 PIN / MSOP8 8-lead
Known Good Die (KGD) product is a preferred option for custom System in Package (SiP) solutions requiring small form factor memory. Puya provides SPI NOR Flash KGD products & IIC EEPROM KGD products to meet this requirement....Known Good Die (KGD) product is a preferred option for custom System in Package (SiP) solutions requiring small form factor memory. Puya provides SPI NOR Flash KGD products & IIC EEPROM KGD products to meet this requirement....
More>>Wafer-Level Chip Scale Package (WLCSP) is one of the most cost-effective and space-efficient packaging options. The die size of Puya products has leading competitiveness, so Puya WLCSP is a true chip-scale package. Puya provides WLCSP SPI NOR.....
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