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Known Good Die(KGD)

Known Good Die (KGD) product is a preferred option for custom System in Package (SiP) solutions requiring small form factor memory. Puya provides SPI NOR Flash KGD products & IIC EEPROM KGD products to meet this requirement....


Wafer-Level Chip Scale Package(WLCSP)

Wafer-Level Chips Scale Package (WLCSP) is one of the most cost-effective and space-efficient packaging options.The die size of Puya products has leading competitiveness,so Puya WLCSP is a true chip-scale package.Puya provides WLCSP SPI NOR Flash,IIC EEPROM&VCN Driver products for mobile or portable form factor applications, such as 3D-CCM,digital cameras,smart watches,GPS navigation device,etc.


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